Thai Trade Watch › HS 8486.10.50

Grinding, polishing and lapping machines for processing of semiconductor wafers

HS 8486.10.50 · เครื่องเจียระไน เครื่องขัดมันและเครื่องขัดเรียบ สำหรับ กระบวนการผลิตเวเฟอร์กึ่งตัวนำ

In 2025 Thailand imported ฿168.0M and exported ฿1.3M of Grinding, polishing and lapping machines for processing of semiconductor wafers.

Trade value by year

* Year to date through Jul 2026, not a full year

Top import origins (all years)

• Japan — ฿666.1M
• Singapore — ฿634.0M
• China — ฿149.4M
• Taiwan, Province Of China — ฿55.7M
• United States — ฿44.5M

Top export destinations (all years)

• Singapore — ฿27.3M
• Myanmar — ฿22.3M
• Korea,Republic Of — ฿16.0M
• China — ฿15.6M
• Japan — ฿6.9M

Related products

• Apparatus for rapid heating of semiconductor wafers (HS 8486.10.10)
• Spin dryers for semiconductor wafer processing (HS 8486.10.20)
• Machines for working any material by removal of material, by laser or other light or photon beam in the production of semiconductor wafers (HS 8486.10.30)
• Machines and apparatus for sawing monocrystal semiconductor boules into slices, or wafers into chips (HS 8486.10.40)

Source: Thai Customs. Values in baht; imports at CIF, exports at FOB.