Thai Trade Watch › HS 8486.20.51

Dicing machines for scribing or scoring semiconductor wafers

HS 8486.20.51 · เครื่องตัดแบ่งเวเฟอร์โดยใช้วิธีขีดร่องเวเฟอร์กึ่งตัวนำ

In 2025 Thailand imported ฿56.3M and exported ฿6,600 of Dicing machines for scribing or scoring semiconductor wafers.

Trade value by year

* Year to date through Jul 2026, not a full year

Top import origins (all years)

• Japan — ฿184.0M
• China — ฿31.8M
• Korea,Republic Of — ฿8.6M
• United States — ฿4.4M
• Hong Kong — ฿3.6M

Top export destinations (all years)

• Singapore — ฿4.7M
• Lao Pdr — ฿2.4M
• China — ฿327,001
• India — ฿281,752
• Myanmar — ฿243,309

Related products

• Apparatus for rapid heating of semiconductor wafers (HS 8486.10.10)
• Spin dryers for semiconductor wafer processing (HS 8486.10.20)
• Machines for working any material by removal of material, by laser or other light or photon beam in the production of semiconductor wafers (HS 8486.10.30)
• Machines and apparatus for sawing monocrystal semiconductor boules into slices, or wafers into chips (HS 8486.10.40)

Source: Thai Customs. Values in baht; imports at CIF, exports at FOB.